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Die Brush and Foam Pad for Wafer Thin Dies

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Availability: Out of stock

Regular Price: £5.99

Special Price: £3.99

Quick Overview


Die Brush and Foam Pad for Wafer Thin Dies





The Die Brush measures approximately 5 1/2" x 1 3/4" x 1 1/4" and the
Foam Pad measures approximately 4 1/2" x 7 1/4".

Die Brush and Foam Pad for Wafer Thin Dies

Details

Die Brush and Foam Pad for Wafer Thin Dies

The Die Brush measures approximately 5 1/2" x 1 3/4" x 1 1/4" and the Foam Pad measures approximately 4 1/2" x 7 1/4". Replacement Brush Heads and Foam Pads are sold separately.

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